XAVIS at SEMICON KOREA 2026: Unveiling Complete Nano-to-Micro Scale Inspection Portfolio for AI Chips

Introduces world-leading nanoscale X-ray microscope 'TXM-XUi' and next-generation wafer inspection system 'Xscan-9860A'

X-ray inspection equipment leader XAVIS Corporation (254120) will participate in Korea's largest semiconductor exhibition 'SEMICON KOREA 2026' to unveil a comprehensive lineup of next-generation semiconductor inspection solutions.
 

[Image by XAVIS Corporation]

SEMICON KOREA 2026 will be held at COEX in Seoul for three days from February 11 to 13. SEMICON KOREA is the country's largest exhibition hosted by the Semiconductor Equipment and Materials International (SEMI). Approximately 550 companies from around the world will showcase the latest semiconductor technologies at their booths, while major global semiconductor companies and key supply chain stakeholders will gather to exchange semiconductor technology information and explore business collaborations.
 
At this exhibition, XAVIS will present its world-class X-ray inspection equipment lineup and transform from a semiconductor X-ray inspection equipment company into a 'Total X-ray Inspection Solutions Provider utilizing AI.'
 
The TXM-XUI to be showcased at this exhibition is a nanoscale 4D X-ray microscopy solution targeting the high-performance industrial research equipment market. It is a next-generation X-ray microscope supporting ultra-high resolution imaging up to 30nm.
 

Additionally, the Xscan-9860A, a wafer-level package inline inspection equipment, provides 0.25μm image resolution utilizing AI and is equipped with a 2D/3D hybrid inspection system and high-speed CT technology. It supports OHT (Overhead Transfer System)-based automatic wafer cassette loading and unloading functions (EFEM, Equipment Front End Module), enabling easy integration with smart factory environments. With various features and X-ray dose reduction technology, it can provide customized solutions to meet diverse customer requirements.
 
As multiple companies target commercialization of glass substrates (TGV, Through Glass Via) in 2026, XAVIS will also unveil high-resolution, high-speed CT equipment capable of 100% inspection of large-area panels measuring 515x510mm.
 
XAVIS representative stated, "As demand for advanced semiconductors surges in the AI era, the importance of high-precision, high-speed inspection equipment is growing significantly." They added, "As the only company in the world with inspection technology covering from nano-scale to micro-scale, XAVIS will demonstrate its leading technological capabilities in the global semiconductor inspection market at SEMICON KOREA 2026."
  

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